株式会社ひびき精機

What it does

"Hibiki Seiki is a leading company in the field of advanced manufacturing, specializing in high-precision products that combine lathe and machining elements. With a focus on technology and skill transfer, our team of young artisans continuously provide expertise in precision cutting processes. By digitizing daily processing ideas and know-how, we have developed implicit knowledge in lathe and milling operations, fostering the transfer of knowledge and skills through student recruitment. Our expertise lies in ultra-thin precision cutting, particularly in the micron-level processing of thin metal parts widely used in the semiconductor industry. We excel in providing value-added solutions for lightweight development projects, catering to industries like aerospace with our ultra-thin precision cutting capabilities. As a research and development partner, we offer design support based on our extensive processing experience. Since our establishment in 1967, we have contributed to a diverse range of industries including shipbuilding, semiconductor, aerospace, and healthcare. Through active participation in international trade shows and events, we support various industries from scratch with our manufacturing capabilities. Additionally, we are actively involved in the local 5G trial initiative with NTT West Japan, aiming to enhance connectivity and innovation. Our participation in prestigious events such as the 'Manufacturing Japan Award' and the ISEF2 Ministerial Meeting showcases our commitment to technological advancement and global collaboration."